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STAR Quality Inspection Framework

Briocean maintains a keen focus on fulfilling client’s requirements by delivering high-quality electronic components.

  • Specialization
  • Trackable
  • Assurance
  • Reliability


Always be there to understand customers’ needs and provide customized solutions for effective, on-time procurement.


Our whole sourcing process, including supplier evaluation, quality inspections, warehousing, and transportation, is entirely trackable for every component we sourced.


Top-end testing equipment and well-trained engineers ensure the electronic components we sourced to meet high standards and hit the target.


Reliability is a way of being and the basis of trust. Every team member needs to deliver consistently, as every employee impacts on our quality standards.

Stringent Quality Control System

Briocean established an international recognised quality control systems (QCS) and constructed two Quality Control Centers in Hong Kong and Shenzhen with an approximate area of 1,000 square meters, over 60 sets of professional inspection equipment, and more than 50 professional inspection engineers. Briocean’s QCS management system covers every inspection process from warehousing, package verification to product appearance and electrical testing. We comply to international standards and we believe “never let any counterfeit products to be delivered to the clients”.

Smart Quality Inspection Process

As a reliable counterfeit prevention and quality assurance distributor, we are committed to test and validate electronic components by leveraging on our quality inspection process.

Testing Services

We understand our customers have unique requirements. As part of our effort to offer better services, we provide continuous training to our employees and upgrade our equipment regularly.

10 Testing Services we offer:

  • X-Ray Non-Destructive Flaw Inspection

    Conduct real-time non-destructive analysis to inspect the hardware within the component to detect lead frame of the chip, wafer size, gold wire binding diagram, ESD’s holes and damage.
  • Static Parameter Test

    Set the relevant parameters according to the datasheet to ensure the actual value of the passive components is within the acceptable error range.
  • Impedance Analysis Test

    To verify that there is no deviation between the Impedance value and specification difference of Impedance devices.
  • ESD Anti-Static Test

    To verify the surface Impedance co-efficiency, grounding resistance, the instantaneous value and peak value of electrostatic potential of objects such as electrostatic protection materials, device packaging and insulating materials.
  • Solderability Testing

    Check if the tinning ability of the chip pin meets the J-STD-002B standard.
  • High Temperature Aging

    Provides standardised and professional baking and vacuum packaging to avoid moisture damage to the chip, control the temperature of the solder reflow to maintain the usability and reliability of the chip.
  • XRF Elemental Measurement and Analysis

    To conduct XRF analysis to ensure the component’s materials are compliant with RoHS regulations.
  • Decapsulation

    Provides decapping service to remove the die completely to check the screen printing, logo information on the wafer, ensuring authenticity of component.
  • SAM Failure Analysis

    Ultrasonic scanning to identify interior materials of electronic component such as delamination, cracks, voids, silicon wafer tilt and foreign contaminants.
  • MCU Programming Test

    Conduct programming testing to ensure components have not been programmed and are in their original factory configuration.


Our attention on quality is backed by third-party certifications and memberships.