We would like to inform that our genuine website link is www.briocean.com. Any websites resembling our content does not belong to Briocean.
Please exercise caution and remain vigilant about such deceptive websites or you can check in with us at marketing@briocean.com.

  • English

  • German

  • Spanish

EN

Capabilities

Stringent Quality Control System

At Briocean, we prioritize providing top-quality electronic components to our clients. We have established two advanced Quality Control Centres in Hong Kong and Shenzhen, spanning 1,000 square meters, and equipped with over 60 sets of inspection equipment and over 50 professional engineers. Our QCS management system covers all inspection processes, from warehousing to electrical testing, ensuring compliance with international standards. Our mission is to never let counterfeit products reach our clients.

  • Established two quality control centres in Hong Kong & Shenzhen
  • Each QC centre spans across 1,000 square meters
  • Equipped with over 60 sets of inspection equipment
  • A team of over 50 skilled and professional engineers

Star Quality Inspection Framework

Briocean maintains a keen focus on fulfilling client’s requirements by delivering high-quality electronic components.

  • Specialisation
  • Trackable
  • Assurance
  • Reliability
  • Specialisation

    Always be there to understand customers’ needs and provide customised solutions for effective, on-time procurement.

  • Trackable

    Every aspect of our sourcing process, from supplier assessment and quality control to warehousing and transportation, can be easily tracked for each component that we have acquired.

  • Assurance

    Our rigorous testing equipments and skilled engineers provide assurance that the electronic components we procure meet the highest standards and meet our target objectives.

  • Reliability

    Consistency is essential for building trust, which in turn is rooted in reliability. It is crucial for every member of our team to deliver their best consistently as every employee's performance impacts our quality standards.

Smart Quality Inspection Process

Briocean implements a rigorous 4-tier quality inspection process to ensure that all electronic components meet the highest standards of quality. The first tier involves a visual inspection of the components to check for any physical defects or abnormalities. The second tier includes testing the components to ensure that they meet the required specifications and performance standards. The third tier consist of conducting a comprehensive reliability test to ensure that the components can perform under different conditions and environments. Additionally, Briocean offers an optional fourth tier, where Briocean collaborate with a third-party inspection entity to conduct further testing. This multi-tiered approach allows Briocean to provide high-quality electronic components that are reliable and perform optimally in a range of applications.

  • Tier4

    Third Party Inspection

  • Tier1

    Labelling and Packaging Verification

  • Tier2

    Visual and Marking Inspection

  • Tier3

    Functional and Reliability Testing

  • Tier4

    Third Party Inspection

  • Tier1

    Labelling and Packaging Verification

  • Tier2

    Visual and Marking Inspection

  • Tier3

    Functional and Reliability Testing

  • Testing Services

    We understand our customers have unique requirements. As part of our effort to offer better services, we provide continuous training to our employees and upgrade our equipment regularly.

    10 Testing Services we offer:

    • X-Ray Non-Destructive Flaw Inspection

      Utilizes real-time, non-destructive imaging to evaluate semiconductor components, including lead frames, wafer dimensions, wire bonding structures, ESD-related damage, and internal voids or defects.
    • Discrete Device Static Parameter Testing

      Testing is conducted according to the device’s pin definitions, characteristic diagrams, and electrical parameters specified in the product datasheet.
    • Impedance Analysis Test

      Measure the impedance value of the device under test (DUT) to verify that it conforms to the datasheet specifications without discrepancy.

    • ESD Anti-Static Test

      Primarily used to verify the surface resistivity, ground resistance, and instantaneous and peak values of electrostatic potential on objects such as device packaging and insulating materials.
    • Solderability Testing

      Verifies whether the solderability of the chip pins meets the requirements. Test standard: J-STD-002B.
    • High Temperature Aging Test

      Provides standard professional baking and vacuum packaging to protect chips from moisture damage, control the temperature during solder reflow, and maintain chip usability and reliability.
    • XRF Non-Destructive Elemental Composition Analysis

      Provides XRF testing to ensure that the content of controlled elements in the materials used for components complies with RoHS standards.
    • Decapsulation Inspection

      The wafer is fully decapsulated and extracted for inspection of die markings, laser etching, and logo information. The collected wafer-level identification data is then cross-verified to further assess and confirm product authenticity and originality.
    • Scanning Acoustic Microscopy (SAM) Inspection

      A non-destructive inspection method that uses acoustic impedance contrast to identify internal defects, determining defect shape, size, and orientation within semiconductor packages and materials.
    • MCU Programming & Verification Test

      Performs blank check, data readback, programming, functional verification, and erase validation on MCUs to ensure the device is in factory-initialized condition and all operations comply with programming integrity requirements.

    Certifications

    Our attention on quality is backed by third-party certifications and memberships.

    • AS9120
    • AS6081
    • ISO9001:2015
    • ISO 14001
    • AS9120
    • AS6081
    • ISO9001:2015
    • ISO 14001
    Select Your Language [gtranslate]